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Copper and Sui Partner To Build Out Full Institutional Accessibility
June 26, 2024 – London, United Kingdom
Copper – a leader in digital asset custody, collateral management and prime services – is excited to announce its latest integration with Sui, a high-performance layer one blockchain and smart contract platform.
The strategic partnership will enable robust custody infrastructure support for stablecoin and RWA (real-world asset) issuers on Sui such as Ondo (USDY), marking a significant advancement in connecting institutional finance to on-chain opportunities on the Sui Network.
With Copper on board, the Sui ecosystem now has built the additional foundational infrastructure necessary to enable institutional players to leverage Sui’s industry-leading decentralized technology platform, addressing the need for financial institutions seeking efficient treasury services for their tokens.
Greg Siourounis, managing director of the Sui Foundation, said,
“This strategic partnership – integrating Copper’s enterprise-grade custody tooling – exemplifies the continued maturation of the Sui ecosystem into a platform capable of supporting the heightened infrastructure needs of Sui’s institutional builders and users.
“We are truly excited about the number and diversity of new projects and assets this partnership will enable for both the Copper and Sui ecosystems.”
The first phase of support – encompassing SUI and native Sui tokens – is currently complete, making Copper a custodian for these assets.
The immediate availability of Copper’s infrastructure on Sui means it is ready to serve the needs of large institutional traders and market makers today.
Further features in staking and DeFi are in development and will be integrated soon, significantly expanding the functionality of Copper’s offerings on Sui.
Dmitry Tokarev, CEO of Copper, said,
“We’re excited to be a part of the Sui ecosystem with Copper as custodian. With staking and DeFi features currently in development, we’re looking forward to the evolution of this partnership.”
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